Chip fuse with floating leads

A chip fuse comprising:

• a fuse body comprising:
• an electrically insulating first floating lead support layer;
• a metallic first floating lead and a metallic second floating lead disposed on the floating lead support layer in a spaced apart arrangement to define a gap between the first floating lead and the second floating lead;
• an electrically insulating second floating lead support layer disposed on the first floating lead and the second floating lead;
• a metallic third floating lead and a metallic fourth floating lead disposed on the second floating lead support layer in a spaced apart arrangement to define a gap between the third floating lead and the fourth floating lead;
• at least one electrically insulating barrier layer disposed on the third floating lead and the fourth floating lead;
• an electrically insulating fuse support layer disposed on the at least one barrier layer;
• an electrically conductive fuse layer disposed on the fuse support layer, the fuse layer comprising a first terminal portion and a second terminal portion connected by a fusible portion;
• and
• an electrically insulating protective layer disposed on the fuse layer;
• and
• an electrically conductive first end termination and an electrically conductive second end termination disposed on opposing ends of the fuse body, wherein the first end termination is electrically connected to the first terminal portion, the first floating lead, and the third floating lead, and wherein the second end termination is electrically connected to the second terminal portion, the second floating lead, and the fourth floating lead.