Multilayer electronic component

A multilayer electronic component comprising:

• a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
• an external electrode including a connection portion disposed on the third or fourth surface and a band portion extending onto portions of the first and second surfaces from the connection portion,
• wherein the external electrode includes a lower electrode layer in contact with a corresponding internal electrode and disposed at the connection portion and the band portion, an intermediate electrode layer disposed at the band portion and disposed on the lower electrode layer, and an upper electrode layer in contact with the lower electrode layer at the connection portion and in contact with the intermediate electrode layer at the band portion,
• the lower electrode layer includes a first metal including copper (Cu) as a main component thereof, and
• the intermediate electrode layer includes a second metal including silver (Ag) as a main component thereof.

A multilayer electronic component, comprising:

• a body including internal electrodes and dielectric layers stacked alternately in a thickness direction;
• an external electrode comprising a band portion disposed on surfaces of the body opposing in the thickness direction and a connection portion disposed on a surface connecting thickness-wise opposing surfaces of the body,
• wherein the external electrode includes:
• a lower layer comprising copper, contacts an internal electrode at the connection portion and extends to the band portion,
• an intermediate layer comprising silver, disposed on the lower layer in the band portion,
• an alloy layer comprising a copper-silver alloy disposed at an interface between the lower layer and the intermediate layer in the band portion, and
• an upper layer contacting the intermediate layer in the band portion and contacting the lower layer in the connection portion.