Multilayer electronic component

A multilayer electronic component comprising:

• a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
• and
• first and second external electrodes each of which including a connection portion disposed on the third surface or the fourth surface of the body and a band portion extending onto portions of the first and second surfaces from the connection portion,
• wherein the first external electrode includes a base alloy layer including a copper (Cu)-silver (Ag) alloy and disposed in the band portion, a lower electrode layer in contact with the internal electrode at the connection portion and in contact with the base alloy layer at the band portion, and an upper electrode layer disposed on the lower electrode layer,
• the lower electrode layer includes copper (Cu), and
• the upper electrode layer includes silver (Ag) and glass.