Multilayer electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoung Bin JEONG, Hyung Jong CHOI, Kwan Hee YUN, Hyun Tak KIM, Jin Sung LEE, Boo Min NOH, Min Woo KIM
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoung Bin JEONG, Hyung Jong CHOI, Kwan Hee YUN, Hyun Tak KIM, Jin Sung LEE, Boo Min NOH, Min Woo KIM
Estimating the term…
A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; and external electrodes disposed outside the body, wherein the external electrode includes a lower electrode layer including copper (Cu) and in contact with the internal electrode, an upper electrode layer including silver (Ag) and disposed on the lower electrode layer, and an alloy layer including a copper (Cu)-silver (Ag) alloy and disposed at an interface between the lower electrode layer and the upper electrode layer, and an oxidation region including copper (Cu) oxide is disposed on at least a portion of an external surface of the lower electrode layer.
A multilayer electronic component comprising:
A multilayer electronic component comprising:
Dependencies are inferred from the claim text.