Electronic device including heat dissipation structure

An electronic device comprising:

• a housing comprising a first housing and a second housing;
• a hinge module comprising a hinge accommodated in the housing and connected to the first housing and the second housing;
• a display disposed over the first housing, the hinge module, and the second housing;
• a support comprising a first side wall positioned inside the first housing and a second side wall positioned inside the second housing;
• and
• a heat dissipation structure comprising a first area bonded to the first side wall, a second area bonded to the second side wall, and a third area positioned between the first area and the second area, and configured to be folded based on the third area,
• wherein the heat dissipation structure comprises a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, and
• wherein the second thermal conductivity is lower than the first thermal conductivity, the protective layer is covering at least a portion of the heat dissipation layer.