Mold assembly for assembling touch module in housing and assembling method using the same

An assembling method, for assembling a touch module in a housing, wherein the touch module comprises a carrier, a circuit board, and a touch film, the housing comprises an opening corresponding to the touch module, a plurality of positioning elements and a plurality of securing elements is provided around the opening, for positioning and fixing the touch module, and the assembling method comprises:

• providing a mold assembly, wherein the mold assembly comprises a base, comprising an upper surface, wherein the upper surface comprises a concave corresponding to the carrier;
• a first frame, detachably disposed on the upper surface and comprising a first opening corresponding to the circuit board;
• and a second frame, detachably disposed on the upper surface and comprising a second opening corresponding to the touch film;
• placing the carrier in the concave;
• disposing the first frame on the upper surface, and assembling the circuit board on the carrier;
• removing the first frame from the base;
• disposing the second frame on the upper surface, and assembling the touch film on the circuit board to form the touch module;
• removing the second frame from the base;
• moving the base along with the touch module to the opening, and enabling the touch module to face the opening;
• positioning the base by using the positioning elements;
• and
• fixing the touch module to the housing by using the securing elements.