Protective film forming composition
AssigneeNissan Chemical Corporation
InventorSatoshi KAMIBAYASHI
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Abstract
A protective film forming composition for forming a protective film that protects an inorganic film formed on a surface of a semiconductor substrate against wet etching, the protective film forming composition including: a polymer having a partial structure represented by Formula (A) and a solvent. In Formula (A), R1 is an (n+2)-valent organic group, R2 is a hydrogen atom or an alkyl group having 1 to 13 carbon atoms which may be substituted with a substituent, n is 1 or 2, and * is a bond.
Claims10
A protective film forming composition for forming a protective film that protects an inorganic film formed on a surface of a semiconductor substrate against wet etching, the protective film forming composition comprising:
- a polymer having a partial structure represented by Formula (A) and a solvent,
- in Formula (A), R1 is an (n+2)-valent organic group, R2 is a hydrogen atom or an alkyl group having 1 to 13 carbon atoms which may be substituted with at least one group selected from the group consisting of an alkoxy group having 1 to 13 carbon atoms, an alkylcarbonyloxy group having 2 to 13 carbon atoms, an alkoxycarbonyl group having 2 to 13 carbon atoms, an alkylthio group having 1 to 13 carbon atoms, a nitro group, an alkylsulfonyloxy group having 1 to 13 carbon atoms, and an alkoxysulfonyl group having 1 to 13 carbon atoms, n is 1 or 2, when n is 2, two R2 may be same or different, and * is a bond.
Dependencies are inferred from the claim text.