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US 2025/0155812 A1Published application
Photosensitive resin composition, photosensitive resin film, photosensitive dry film, and pattern-forming process
AssigneeShin-Etsu Chemical Co., Ltd.
InventorHitoshi MARUYAMA
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Abstract
The present invention is a photosensitive resin composition including, (A) an acid-crosslinkable group-containing silicone resin, (B) an oxazoline compound or a derivative thereof, and (C) a photo-acid generator. This provides: a photosensitive resin composition that can easily form a thick and fine pattern without causing discoloration of copper and can form a resin film that is excellent in copper migration resistance, adhesiveness to a base material, and reliability; a photosensitive resin film; a photosensitive dry film; and a pattern-forming process by using these.
Claims13
A photosensitive resin composition comprising:
- (A) an acid-crosslinkable group-containing silicone resin;
- (B) an oxazoline compound or a derivative thereof;
- and
- (C) a photo-acid generator.
1 more element
Dependencies are inferred from the claim text.