Back to results
US 2025/0155798 A1Published application
Tin compound, tin composition, producing methods thereof, resist solution, pattern forming method, thin film, patterned thin film, and method for producing substrate
AssigneesMitsubishi Chemical Corporation, Gelest, Inc.
InventorsYuta Hioki, Sumiko Yahata, Ko Urushibara Okabe
Life of this patent
Estimating the term…
Abstract
As a high-performance resist material, a tin compound is provided which has properties such as solubility, hydrophobicity, and resist sensitivity with good balance. A tin compound includes a tin atom; an organic group R; and at least one of an oxo-ligand and a hydroxo-ligand. One molecule of the tin compound includes two or more types of organic group R and includes a Sn—O—Sn structure, and the organic group R has 1 to 30 carbon atoms.
Claims33
A tin compound, comprising:
- a tin atom;
- an organic group R;
- and
- at least one of an oxo-ligand and a hydroxo-ligand,
- wherein one molecule of the tin compound includes two or more types of the organic group R and includes a Sn—O—Sn structure, and
- wherein the organic group R has 1 to 30 carbon atoms.
3 more elements
A method for producing at least one of a tin compound and a tin composition, comprising:
- a tin atom,
- an organic group R;
- and at least one of an oxo-ligand and a hydroxo-ligand,
- the method comprising following steps:
- <step 1> blending the two or more precursors RSnX3 (A1) having different structures of the organic group R to obtain a precursor mixture, wherein X represents a hydrolysable group;
- and
- <step 2> contacting a blend of the precursor mixture and an organic solvent with liquid water.
4 more elements
Dependencies are inferred from the claim text.