Test jig, testing method, and method of manufacturing semiconductor device

A test jig for testing each semiconductor device of a plurality of semiconductor devices formed on a wafer that is placed under the test jig during the testing, the test jig comprising:

• a substrate having an opening extending therethrough in an up-down direction, so as to allow air to be injected from the opening in a thickness direction of the wafer during the testing;
• a chamber formed to surround the opening, and positioned lower than the substrate;
• and
• first probe for measuring said each semiconductor device, the first probe being connected to the substrate, wherein
• the chamber includes:
• a surrounding member that surrounds the first probe, the surrounding member being configured to float upward in response to the injection of the air from the opening during the testing;
• a support part configured to support the surrounding member, the support part supporting the surrounding member before the surrounding member floats upward during the testing;
• and
• a restraining member configured to restrain the surrounding member from lowering such that the surrounding member does not contact the wafer after the injection of the air is stopped during the testing.