Method for evaluating semiconductor device, method for producing semiconductor device, and semiconductor device

A method for producing a semiconductor device comprising:

• forming a transmission line on a surface of a substrate;
• mounting a semiconductor chip and a surface mount device on the surface of the substrate and connecting the semiconductor chip and the surface mount device to each other by the transmission line;
• preparing a resin cover including a first recess provided in a portion corresponding to the semiconductor chip and a second recess provided in a portion corresponding to the surface mount device;
• and
• aligning the resin cover such that the first recess accommodates the semiconductor chip and the second recess accommodates the surface mount device, and pressing the resin cover against the transmission line by means of a hold-down jig so as to evaluate the semiconductor device,
• wherein the resin cover has a relative dielectric constant of 3 to 4.

A semiconductor device comprising:

• a substrate;
• a transmission line provided on a surface of the substrate;
• a semiconductor chip and a surface mount device mounted on the surface of the substrate and connected to each other by the transmission line;
• a solder resist covering the transmission line;
• and
• a molding resin covering the transmission line, the semiconductor chip, the surface mount device and the solder resist,
• wherein the solder resist includes a resist having a relative dielectric constant of 4.5 or greater, and
• the solder resist includes a two-layer structure of a resist having a relative dielectric constant of 3 to 4 and a resist having a relative dielectric constant of 4.5 or greater.