Method for manufacturing current sensor
AssigneeDenso Corporation
InventorsKazuhiro YOSHINO, Takeshi TSUKAMOTO, Akito SASAKI
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AssigneeDenso Corporation
InventorsKazuhiro YOSHINO, Takeshi TSUKAMOTO, Akito SASAKI
Estimating the term…
In a method for manufacturing a current sensor, a wiring board is placed by bringing the wiring board into contact with board contact portions of a sensor housing while deforming an adhesive applied on top surfaces of board adhesion portions of the sensor housing between the board adhesion portions and the wiring board, and a shield is placed by bringing the shield into contact with shield contact portions of the sensor housing while deforming an adhesive applied on top surfaces of shield adhesion portions of the sensor housing between the shield adhesion portions and the shield. After the placing of the wiring board and the placing of the shield, both the adhesive positioned between the board adhesion portions and the wiring board and the adhesive positioned between the shield adhesion portions and the shield are cured simultaneously.
A method for manufacturing a current sensor, the method comprising:
Dependencies are inferred from the claim text.