Cooling unit, objective lens module, and semiconductor inspection apparatus

A cooling unit for using in a semiconductor device test, comprising:

• a jacket configured to dissipate heat of the semiconductor device,
• wherein the jacket includes a central portion, and an outer portion located around the central portion,
• an opening through which light from the semiconductor device passes is formed in the central portion,
• the outer portion includes a contact portion that comes into contact with a stage on which the semiconductor device is disposed,
• a supply flow passage through which a cooling fluid for cooling the semiconductor device flows is formed in the jacket,
• a groove configured so that the cooling fluid flows down from an upper surface of the central portion is formed between the central portion and the outer portion in the jacket, and
• a discharge flow passage through which the cooling fluid to be discharged to an outside flows is connected to the groove.