US 2025/0154677 A1 · EASILY CRUSHABLE ELECTRODEPOSITED COPPER

Abstract

A highly pure electrodeposited copper comprising copper and unavoidable impurities, wherein the purity is at least 6N, the content of Ag included as an impurity is 0.2 ppm or less, the amount of included nonmetal inclusions with a particle size of 0.5-20 μm is 20,000/g or less, the average particle size in an electrodeposition cross section is in the range of 40-400 μm, the maximum particle size in the electrodeposition cross section is in the range of 300-2,700 μm, the average particle size in the electrodeposition surface is in the range of 25-150 μm, and the maximum particle size in the electrodeposition surface is in the range of 100-450 μm. As a result, the present invention provides a highly pure electrodeposited copper that has excellent crushability while suppressing the occurrence of lumps.

Claims10

Dependent claims

A high-purity electrodeposited copper comprising copper and inevitable impurities, wherein the high-purity electrodeposited copper has:

a purity of 6N or more;
an amount of Ag contained as an impurity of 0.2 ppm or less;
a number of contained nonmetallic inclusions with a grain size of 0.5 μm or more and 20 μm or less of 20,000 or less per gram;
an average grain size of an electrodeposition cross section in a range of 40 to 400 μm;
a maximum grain size of an electrodeposition cross section in a range of 300 to 2700 μm;
an average grain size on an electrodeposited surface in a range of 25 to 150 μm;
and
a maximum grain size on an electrodeposited surface in a range of 100 to 450 μm.

5 more elements

Dependencies are inferred from the claim text.

Easily crushable electrodeposited copper

Life of this patent

Easily crushable electrodeposited copper

Life of this patent

Abstract

Claims10