Resin composition and article made therefrom

Abstract

A resin composition is disclosed, comprising: (A) 100 parts by weight of an unsaturated carbon-carbon double bond-containing polyphenylene ether resin and (B) 20-70 parts by weight of a compound represented by Formula (1), wherein in Formula (1), X is adamantyl group, each of R1-R8 is independently hydrogen atom or C1-C3 alkyl group, at least one of R1-R8 is C1-C3 alkyl group, and n is an integer of 1-7. In addition, an article made from the above resin composition is also disclosed. The article comprises a prepreg, a resin film, a laminate or a printed circuit board, and has improvements in one or more of the following properties: glass transition temperature, T300 thermal resistance, percent thermal expansion at Z-axis, dissipation factor, dissipation factor variation rate under moisture and heat, dissipation factor variation rate under heat, water absorption rate and thermal resistance after moisture absorption.

Dependencies are inferred from the claim text.