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US 2025/0154300 A1Published application
Resin composition and curable resin composition using the same
AssigneeNamics Corporation
InventorYu YOSHII
Life of this patent
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Abstract
A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below: and a molecular weight of 230˜1,000, and (B) fumed silica having an average primary particle size of 1 nm˜50 nm and a specific surface area of 50 m2/g˜250 m2/g.
Claims20
A resin composition comprising:
- (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:
- and a molecular weight of 230˜1000;
- and
- (B) fumed silica having an average primary particle size of 1 nm˜50 nm and a specific surface area of 50 m2/g˜250 m2/g.
1 more element
Dependencies are inferred from the claim text.