Multilayer films, polyimide films and coverlay packages

Abstract

In a first aspect, a multilayer film includes a polymer substrate having a glass transition temperature of 240° C. or higher, a release layer adhered to the polymer substrate and a polyimide film layer releasably adhered to the release layer on a side opposite the polymer substrate. The release layer includes a cross-linked silicone having a decomposition temperature of 350° C. or higher. The polyimide film layer has a thickness of 10 μm or less. In a second aspect, a polyimide film having a thickness of 10 μm or less is derived from the multilayer film of the first aspect. In a third aspect. a coverlay package includes the multilayer film of the first aspect, an adhesive layer adhered to the polyimide film layer on a side opposite the release layer, and a release film releasably adhered to the adhesive layer on a side opposite the polyimide film layer.

Dependencies are inferred from the claim text.