Chemical mechanical polishing pad and chemical mechanical polishing apparatus comprising the same

A chemical mechanical polishing apparatus comprising:

• a plate configured to rotate about a vertical axis;
• a chemical mechanical polishing pad on an upper surface of the plate;
• a polishing head facing the chemical mechanical polishing pad in a vertical direction;
• and
• a slurry supply above the plate, spaced apart from the polishing head in a horizontal direction, and configured to discharge polishing slurry toward an upper surface of the chemical mechanical polishing pad,
• wherein the chemical mechanical polishing pad comprises a body including:
• a plurality of first grooves extending downward in the vertical direction from the upper surface of the chemical mechanical polishing pad;
• and
• a plurality of second grooves extending downward in the vertical direction inside the body such that an upper surface of each of the plurality of second grooves is below an upper surface of the body,
• wherein at least two of the plurality of first grooves have different depths in the vertical direction from each other, and
• wherein the upper surfaces of at least two of the plurality of second grooves are at different vertical levels from each other.

A chemical mechanical polishing apparatus comprising:

• a plate configured to rotate about a vertical axis;
• a chemical mechanical polishing pad on an upper surface of the plate;
• a polishing head facing the chemical mechanical polishing pad in a vertical direction;
• a slurry supply above the plate, spaced apart from the polishing head in a horizontal direction, and configured to discharge polishing slurry toward an upper surface of the chemical mechanical polishing pad;
• and
• a pad cleaner above the chemical mechanical polishing pad and configured to clean the chemical mechanical polishing pad,
• wherein the chemical mechanical polishing pad comprises a body comprising:
• a plurality of first grooves extending downward in the vertical direction from the upper surface of the chemical mechanical polishing pad;
• and
• a plurality of second grooves extending downward in the vertical direction inside the body such that upper surfaces of each of the plurality of second grooves are below an upper surface of the body,
• wherein at least two of the plurality of first grooves have different depths in the vertical direction from each other, and
• wherein the upper surfaces of at least two of the plurality of second grooves are at different vertical levels from each other,
• wherein at least one of the plurality of first grooves and at least one of the plurality of second grooves overlap each other in the horizontal direction, and
• wherein each of the plurality of first grooves and the plurality of second grooves has a spiral cross-section on an horizontal plane.