Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling composition

A semiconductor substrate cleaning method comprising:

• removing an adhesive layer provided on a semiconductor substrate by use of a remover composition,
• wherein:
• the remover composition contains a solvent but no salt;
• the solvent comprises one or more species selected from among an aliphatic hydrocarbon compound, an aromatic hydrocarbon compound, an ether compound, a thioether compound, an ester compound, and an amine compound, each having a molecular weight less than 160;
• and
• the remover composition exhibits a contact angle smaller than 31.5° with respect to the adhesive layer.

A processed semiconductor substrate production method comprising:

• producing a laminate having a semiconductor substrate, a support substrate, and an adhesive layer formed from an adhesive composition;
• processing the semiconductor substrate of the produced laminate;
• separating the semiconductor substrate and the adhesive layer from the support substrate;
• and
• removing the adhesive layer on the semiconductor substrate by use of a remover composition,
• wherein:
• the remover composition contains a solvent but no salt;
• the solvent comprises one or more species selected from among an aliphatic hydrocarbon compound, an aromatic hydrocarbon compound, an ether compound, a thioether compound, an ester compound, and an amine compound, each having a molecular weight less than 160;
• and
• the remover composition exhibits a contact angle smaller than 31.5° with respect to the adhesive layer.