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US 2025/0149487 A1Published application
Solder preforms with embedded beads to act as standoffs
AssigneeDell Products L.P.
InventorsJames L. PETIVAN, Earl BOONE, Wallace H. ABLES, Steven R. ETHRIDGE
Life of this patent
Estimating the term…
Abstract
An information handling resource may include a circuit board comprising an electrically-conductive pad, a circuit package comprising an electrically-conductive pin, and reflowed solder electrically coupling the electrically-conductive pad to the electrically-conductive pin, the reflowed solder having embedded therein at least one bead configured to provide mechanical standoff between the pad and the pin.
Claims21
An information handling resource comprising:
- a circuit board comprising an electrically-conductive pad;
- a circuit package comprising an electrically-conductive pin;
- and
- reflowed solder electrically coupling the electrically-conductive pad to the electrically-conductive pin, the reflowed solder having embedded therein at least one bead configured to provide mechanical standoff between the pad and the pin.
1 more element
An information handling system comprising:
- a processor;
- and
- an information handling resource comprising:
- a circuit board comprising an electrically-conductive pad;
- a circuit package comprising an electrically-conductive pin;
- and
- reflowed solder electrically coupling the electrically-conductive pad to the electrically-conductive pin, the reflowed solder having embedded therein at least one bead configured to provide mechanical standoff between the pad and the pin.
4 more elements
A method comprising:
- placing solder on an electrically-conductive pad of a circuit board, the solder having embedded therein at least one bead;
- aligning an electrically-conductive pin of a circuit package with the solder and the pad;
- and
- applying heat to the solder to create reflowed solder to electrically couple the electrically-conductive pad to the electrically-conductive pin such that the at least one bead provides mechanical standoff between the electrically-conductive pad and the electrically-conductive pin.
1 more element
Dependencies are inferred from the claim text.