Semiconductor package

A semiconductor package comprising:

• a semiconductor chip that has a first region and a second region spaced apart from the first region;
• a first pad on the semiconductor chip in the first region;
• a second pad on the semiconductor chip in the second region;
• a first solder on and coupled to the first pad;
• and
• a second solder on and coupled to the second pad,
• wherein the first pad has a first recess from a top surface of the first pad,
• wherein the second pad has a second recess from a top surface of the second pad,
• wherein a volume of an inner section of the second recess is greater than a volume of an inner section of the first recess, and
• wherein a height of the first solder is about 90% to about 100% of a height of the second solder.

A semiconductor package comprising:

• a first substrate;
• a plurality of first pads on the first substrate;
• a second substrate on the first substrate;
• a plurality of second pads on the second substrate;
• and
• a plurality of solders that respectively connect the plurality of first pads to the plurality of second pads,
• wherein the plurality of first pads have recesses from top surfaces of the first pads,
• wherein widths of the recesses increase in a direction from a center of the first substrate toward an outer lateral surface of the first substrate, and
• wherein heights of the plurality of solders increase in the direction from the center of the first substrate toward the outer lateral surface of the first substrate.