High-frequency circuit component

A high-frequency circuit component, comprising:

• a first chip that includes a first insulating layer, a first device layer laminated on the first insulating layer, a first multilayer wiring layer laminated on the first device layer, and a first anchor configured as a high-frequency circuit;
• and
• a second chip that includes a substrate, a second multilayer wiring layer on the substrate, and a second anchor configured as a control circuit that controls the high-frequency circuit,
• wherein
• the first anchor is embedded in the first device layer and the first insulating layer, and exposed from a surface of the first insulating layer,
• the second anchor is embedded in the second multilayer wiring layer, and exposed from a surface of the second multilayer wiring layer, and
• the first anchor and the second anchor include an identical metal material, and a portion of the first anchor exposed from the surface of the first insulating layer and a portion of the second anchor exposed from the surface of the second multilayer wiring layer are connected to each other.