Package structure with reinforced element

A package structure, comprising:

• a reinforced plate;
• a redistribution structure over the reinforced plate, wherein the redistribution structure comprises a plurality of polymer-containing layers and a plurality of conductive features, the reinforced plate is thinner than the redistribution structure, and a thickness ratio of a first thickness of the reinforced plate to a second thickness of the redistribution structure is greater than about 0.5;
• a plurality of chip structures bonded to the redistribution structure;
• a protective layer surrounding the chip structures;
• and
• a thermal conductive structure extending across outermost edges of the chip structures.

A package structure, comprising:

• a reinforced plate;
• a redistribution structure over the reinforced plate, wherein the redistribution structure comprises a plurality of polymer-containing layers and a plurality of conductive features, the reinforced plate is thinner than the redistribution structure, and a thickness ratio of a first thickness of the reinforced plate to a second thickness of the redistribution structure is greater than about 0.5;
• a plurality of chip structures bonded to the redistribution structure through a plurality of solder bumps;
• a protective layer surrounding the chip structures;
• and
• a thermal conductive structure extending across an interface between the protective layer and the chip structures.