Multi-device graded embedding package substrate and manufacturing method thereof

A multi-device graded embedding package substrate, comprising:

• a first dielectric layer comprising a first conductive copper pillar layer penetrating through the first dielectric layer along a height direction and a first device cavity;
• a second dielectric layer above the first dielectric layer, the second dielectric layer comprising a first wiring layer located in a lower surface of the second dielectric layer, a second conductive copper pillar layer and a heat dissipation copper block layer which are provided on the first wiring layer;
• a third dielectric layer below the first dielectric layer, the third dielectric layer comprising a second wiring layer located in an upper surface of the third dielectric layer, a third conductive copper pillar layer provided on the second wiring layer,
• a first device attached to a bottom of the first device cavity so that a terminal of the first device is conductively connected to the second wiring layer, the first device connected to the heat dissipation copper block layer via the first wiring layer;
• a second device cavity penetrating through the first dielectric layer, the second dielectric layer and the third dielectric layer;
• and
• a second device is attached to the bottom of the second device cavity, the second device having a thickness difference from the first device,
• wherein the first wiring layer and the second wiring layer are conductively connected via the first conductive copper pillar layer.