Semiconductor package and method for manufacturing the same

A semiconductor package, comprising:

• a first redistribution structure;
• a first semiconductor die on the first redistribution structure;
• a second semiconductor die on the first redistribution structure and side-by-side with the first semiconductor die;
• a substrate on the first redistribution structure and surrounding each of the first semiconductor die and the second semiconductor die;
• a first molding material surrounding the first semiconductor die and the second semiconductor die, on the first redistribution structure;
• a bridge die on the substrate;
• a second redistribution structure on the substrate and around the bridge die;
• a third semiconductor die on the second redistribution structure and on the bridge die;
• a fourth semiconductor die on the second redistribution structure and on the bridge die;
• a second molding material surrounding the third semiconductor die and the fourth semiconductor die, on the second redistribution structure;
• and
• a surface-mount device (SMD) disposed on the third semiconductor die.

A manufacturing method of a semiconductor package, the manufacturing method comprising:

• forming a first redistribution structure;
• bonding a substrate comprising a first through opening and a second through opening on the first redistribution structure;
• mounting a first semiconductor die on the first redistribution structure and within the first through opening, and mounting a second semiconductor die on the first redistribution structure and within the second through opening;
• forming a second redistribution structure on the first semiconductor die, the second semiconductor die, and the substrate;
• mounting a bridge die within the second redistribution structure;
• and
• mounting a third semiconductor die and a fourth semiconductor die on the second redistribution structure and on the bridge die.