Manufacturing method of electronic package and electronic package

A manufacturing method of an electronic package, comprising:

• forming a first interfacial dielectric layer, a plurality of first conductive vias, and a plurality of second conductive vias on a first temporary carrier, wherein the first interfacial dielectric layer covers the first temporary carrier, sides of the plurality of first conductive vias, and sides of the plurality of second conductive vias;
• disposing a plurality of chips on the first interfacial dielectric layer, wherein a plurality of first chip pads and a plurality of second chip pads on an active surface of each of the plurality of chips are directly bonded to the plurality of first conductive vias and the plurality of second conductive vias respectively;
• forming a base dielectric layer to cover the first interfacial dielectric layer and sides of the plurality of the chips, wherein the base dielectric layer fills a gap between the plurality of adjacent chips;
• removing the first temporary carrier;
• fixing the plurality of chips and the first interfacial dielectric layer to a second temporary carrier;
• disposing a bridge element on the first interfacial dielectric layer, such that the bridge element partially overlaps the plurality of adjacent chips respectively, wherein a plurality of bridge pads of the bridge element are directly bonded to the plurality of first conductive vias respectively;
• forming a second interfacial dielectric layer and a plurality of third conductive vias on the first interfacial dielectric layer and the bridge element, wherein each of the plurality of third conductive vias passes through the first interfacial dielectric layer to be connected to the plurality of second conductive vias respectively;
• forming a redistribution circuit structure on the second interfacial dielectric layer and the plurality of third conductive vias;
• forming a plurality of conductive bumps on the redistribution circuit structure;
• and
• removing the second temporary carrier.