Composite component device and method for manufacturing the same

A composite component device comprising two or more composite component layers having an electronic component layer and a rewiring layer on the electronic component layer,

• wherein
• the two or more composite component layers are laminated in a thickness direction such that the electronic component layer and the rewiring layer are alternately disposed,
• the electronic component layer has one or more electronic components having:
• an electronic component main body having a first surface perpendicular to the thickness direction and a second surface opposed to the first surface;
• and a plurality of component electrodes on the first surface,
• the component electrode of the one or more electronic components is electrically connected to the rewiring layer,
• an electronic component layer in a composite component layer adjacent to the rewiring layer of another composite component layer of the two or more composite component layers further has an electronic component layer through-via electrically connected to the rewiring layer of the another composite component layer,
• the electronic component layer surrounds the one or more electronic components and further has a side wall portion including the electronic component layer through-via,
• the composite component layer adheres to the another composite component layer with an adhesive layer interposed therebetween,
• the electronic component layer through-via has a sidewall through-via through the side wall portion and a conductive via through the adhesive layer,
• the conductive via electrically connects the electronic component layer through-via and a rewiring layer of the another composite component layer, and
• a sectional area of the conductive via is larger than a sectional area of the sidewall through-via in a plane perpendicular to the thickness direction.