Single-sided direct cooled power module

An electronic module comprising:

• a substrate comprising:
• an electrically insulative layer;
• and
• an electrically conductive layer formed on the electrically insulative layer and defining first, second, and third electrically conductive regions that are each electrically insulated from each other, wherein the second electrically conductive region defines an opening, and wherein the third electrically conductive region is disposed within the opening;
• a plurality of high-side power switches disposed on and electrically coupled to the first electrically conductive region;
• a plurality of low-side power switches disposed on and electrically coupled to the second electrically conductive region;
• and
• a power lead coupled to the first electrically conductive region via a spacer.

A method of forming an electronic module, the method comprising:

• forming an insulative layer of a substrate;
• forming first, second, and third electrically conductive regions on a top surface of the substrate, wherein each of the first, second, and third electrically conductive regions are each electrically insulated from each other, wherein the second electrically conductive region defines an opening, and wherein the third electrically conductive region is disposed within the opening;
• attaching a plurality of high-side power switches to the first electrically conductive region;
• electrically coupling a plurality of first connectors between the plurality of high-side power switches and the second electrically conductive region;
• electrically coupling a plurality of low-side power switches to the second electrically conductive region;
• electrically coupling a plurality of second connectors between the plurality of low-side power switches and the third electrically conductive region;
• and
• electrically coupling a power lead to the first electrically conductive region via a spacer.