Packaging structure and method for forming the same

A method for forming a packaging structure, comprising:

• forming a frame, the frame comprising a first molding layer and a base island running through the first molding layer along a first direction, the frame having an upper surface and a lower surface distributed opposed along the first direction;
• connecting a pin structure and a chip on the lower surface of the frame, the chip being electrically connected to the base island, the pin structure comprising at least one pin ring, each of the pin ring comprising a plurality of pins disposed around an outer circumference of the chip, the pins being electrically connected to the chip;
• and
• forming a second molding layer on the lower surface of the frame, the second molding layer covering the chip and the pin structure.

A method for forming a packaging structure, comprising:

• forming packaging units each comprising a base island, a chip connected to the base island, and a pin structure disposed around an outer circumference of the chip, wherein adjacent packaging units of the packaging units are connected to each other by a first molding layer and a second molding layer;
• defining a sawing street between the adjacent packaging units;
• and
• cutting the packaging units along the sawing street to form packaging structures.