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US 2025/0149414 A1Published application
Low z-height separable liquid metal based electrical interconnect
AssigneeIntel Corporation
InventorsZiyin LIN, Karumbu MEYYAPPAN, Gregorio R. MURTAGIAN, Dingying David XU
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Abstract
Embodiments disclosed herein include an interconnect structure. In an embodiment, the interconnect structure is an apparatus that comprises a substrate with a well through a thickness of the substrate. In an embodiment, the substrate comprises a polymer foam. In an embodiment, a liquid metal is in the opening, and the liquid metal comprises voids.
Claims20
An apparatus, comprising:
- a substrate with a well through a thickness of the substrate, wherein the substrate comprises a polymer foam;
- and
- a liquid metal in the opening, wherein the liquid metal comprises voids.
An apparatus, comprising:
- a board;
- and
- an interconnect layer over the board, wherein the interconnect layer comprises:
- a substrate, wherein the substrate comprises an open cell elastomer foam;
- wells through a thickness of the substrate;
- and
- a liquid metal provided in one or more of the wells, wherein voids are provided within a volume of the liquid metal.
4 more elements
An apparatus, comprising:
- a board;
- an interconnect layer over the board, wherein the interconnect layer comprises:
- a substrate with openings through the substrate, wherein the substrate has a Poisson's ratio of less than 0.2;
- and
- a liquid metal in the openings, wherein the liquid metal is compressible;
- and
- a package over the interconnect layer, wherein the package comprises:
- a package substrate;
- and
- a die on the package substrate.
7 more elements
Dependencies are inferred from the claim text.