Leadless semiconductor packages, leadframes therefor, and methods of making

A semiconductor device, comprising:

• a semiconductor die coupled to a die pad;
• a contact comprising an exposed flank;
• an encapsulant coupled at least partially over the semiconductor die and the contact;
• and
• a trench that extends only partially into the encapsulant between the semiconductor die and the die pad, wherein the trench is at least as deep as a thickness of the contact.

A semiconductor device, comprising:

• a semiconductor die;
• a contact adjacent to the semiconductor die;
• a tie bar adjacent to the semiconductor die;
• and
• an encapsulant coupled at least partially over the semiconductor die and the contact;
• wherein a flank of the contact is exposed;
• and
• wherein a trench in a first surface of the encapsulant extends laterally adjacent to the contact for a full vertical thickness of the contact to expose an inner side of the contact, the trench extending only partially into a thickness of the encapsulant.