Electronic component-incorporating substrate

Abstract

An electronic component-incorporating substrate includes a first substrate, a second substrate arranged above the first substrate, a spacer member electrically connecting the first substrate and the second substrate, an electronic component mounted on the first substrate and disposed between the first substrate and the second substrate, a heat dissipation plate disposed between the first substrate and the second substrate, and an encapsulation resin filling a gap between the first substrate and the second substrate and encapsulating the electronic component. The encapsulation resin includes a first outer side surface. At least both of an upper surface and a lower surface of the heat dissipation plate are embedded in the encapsulation resin. The heat dissipation plate does not overlap the spacer member in plan view. The heat dissipation plate includes a second outer side surface exposed from the first outer side surface of the encapsulation resin.

Dependencies are inferred from the claim text.