Cooling system for heterogeneous integrated semiconductor package structure
AssigneeWistron Corporation
InventorsTung-Yang TANG, Chu-Shun CHO, Wen-Hua LIU, Chu-Chia TSAI
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Abstract
A cooling system for a heterogeneous integrated semiconductor package structure is disclosed. The heterogeneous integrated semiconductor package structure is arranged on a circuit board. The cooling system may include a cooling component. The cooling component may be arranged on the heterogeneous integrated semiconductor package structure, and is configured to dissipate heat from the heterogeneous integrated semiconductor package structure by using a cooling fluid.
Claims20
A cooling system for a heterogeneous integrated semiconductor package structure, wherein the heterogeneous integrated semiconductor package structure is arranged on a circuit board, and the cooling system comprises a cooling component arranged on the heterogeneous integrated semiconductor package structure.
Dependencies are inferred from the claim text.