Semiconductor package structure

A semiconductor package structure, comprising:

• a conductive substrate having a chip-bonding surface and a heat-dissipation surface that is opposite to the chip-bonding surface;
• a chip disposed on the chip-bonding surface of the conductive substrate and having a plurality of connection pads that are arranged away from the conductive substrate;
• a plurality of conductive spacers respectively disposed on the connection pads, wherein ends of the conductive spacers are arranged away from the conductive substrate and are coplanar with each other;
• a lead frame connected to the ends of the conductive spacers in a flip-chip manner and having an exposed surface;
• and
• an encapsulant covering the conductive substrate, the chip, the conductive spacers, and the lead frame, wherein the exposed surface and the heat-dissipation surface are exposed from the encapsulant.

A semiconductor package structure, comprising:

• a conductive substrate having a chip-bonding surface and a heat-dissipation surface that is opposite to the chip-bonding surface;
• a plurality of conductive carriers arranged adjacent to the conductive substrate;
• a chip disposed on the chip-bonding surface of the conductive substrate and having a plurality of connection pads that are arranged away from the conductive substrate;
• a plurality of conductive spacers respectively disposed on at least one of the connection pads and at least one of the conductive carriers, wherein ends of the conductive spacers are coplanar with each other;
• a lead frame connected to the ends of the conductive spacers in a flip-chip manner and having an exposed surface;
• and
• an encapsulant covering the conductive substrate, the conductive carriers, the chip, the conductive spacers, and the lead frame, wherein the exposed surface, the heat-dissipation surface, and a surface of each of the conductive carriers are exposed from the encapsulant.