Package structure and manufacturing method thereof

A manufacturing method of a package structure, comprising:

• forming a first package component, wherein the first package component comprises semiconductor dies, a first insulating encapsulation laterally encapsulating the semiconductor dies, and a first redistribution structure on a first surface of the first insulating encapsulation and first surfaces of the semiconductor dies and electrically coupled to the semiconductor dies;
• disposing the first package component on a second package component to connect the first package component with the second package component;
• forming an underfill layer between the first package component and the second package component, wherein the underfill layer extends to cover a sidewall of the first package component;
• placing the second package component inside a jig with a window, wherein the window of the jig accessibly exposes second surfaces of the semiconductor dies, a second surface of the first insulating encapsulation and a portion of an outer surface of the underfill layer, the second surfaces of the semiconductor dies are opposite to the first surfaces of the semiconductor dies, and the second surface of the first insulating encapsulation is opposite to the first surface of the first insulating encapsulation;
• and
• forming a metallic layer on the second surfaces of the semiconductor dies, the second surface of the first insulating encapsulation and the portion of the outer surface of the underfill layer.

A manufacturing method of a package structure, comprising:

• forming a first package component, wherein the first package component comprises semiconductor dies, an insulating encapsulation laterally encapsulating the semiconductor dies, and a redistribution structure on a first surface of the insulating encapsulation and first surfaces of the semiconductor dies;
• coupling the first package component to a second package component;
• forming an underfill layer between the first package component and the second package component, wherein the underfill layer extends to cover a sidewall of the first package component;
• forming a metallic layer on an upper surface of the first package component by using a jig with a window, wherein the window of the jig accessibly exposes the upper surface of the first package component, and in a top view, the metallic layer comprises a rounded corner that corresponds to a rounded corner of the underfill layer.