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US 2025/0149394 A1Published application
Covers for semiconductor package components
OwnerSreenivasan Kalyani KODURI, Leslie Edward STARKinventors
Life of this patent
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Abstract
In some examples, a semiconductor package comprises a semiconductor die; an operational component on an active surface of the semiconductor die; and a cover coupled to the active surface of the semiconductor die and covering the operational component. The cover comprises a monolithic structure including a vertical portion and a horizontal portion. A hollow area is between the cover and the operational component. The package also includes a mold compound covering the semiconductor die and the cover.
Claims17
A semiconductor package, comprising:
- a semiconductor die;
- a bulk acoustic wave (BAW) device on and coupled to a first surface of the semiconductor die;
- a cover coupled to the first surface of the semiconductor die and covering the BAW device, the cover comprising a vertical portion and a horizontal portion, a hollow area between the cover and the BAW device;
- and
- a mold compound covering the semiconductor die and the cover.
2 more elements
Dependencies are inferred from the claim text.