Substrate processing apparatus and substrate processing method

A substrate processing method of processing a substrate by using a substrate processing apparatus,

• wherein the substrate processing apparatus includes:
• a substrate cleaning device configured to clean the substrate;
• a chip cleaning device configured to clean multiple chips in a state where the multiple chips are attached to a frame via a tape;
• a chip bonding device configured to bond the multiple chips to different bonding regions of a main surface of the substrate;
• a transfer section adjacent to the substrate cleaning device, the chip cleaning device, and the chip bonding device;
• a first substrate transfer arm configured to hold and transfer the substrate in the transfer section;
• and
• a first frame transfer arm configured to hold the frame and transfer the frame together with the multiple chips in the transfer section, and
• wherein the substrate processing method includes:
• cleaning the substrate by the substrate cleaning device;
• transferring the substrate from the substrate cleaning device to the chip bonding device by the first substrate transfer arm;
• cleaning the multiple chips by the chip cleaning device;
• and
• transferring the multiple chips together with the frame from the chip cleaning device to the chip bonding device by the first frame transfer arm.