Method for fabricating semiconductor packaging structure and semiconductor packaging structure fabricated using the same

Abstract

A method for fabricating a semiconductor packaging structure is provided. The fabrication method includes providing a lower mold. The fabrication method includes disposing a plurality of semiconductor components on the lower mold. The fabrication method includes disposing a plurality of first metal structures on the lower mold, wherein the first metal structures are located on both sides of the semiconductor components. The fabrication method includes providing an upper mold to assemble with the lower mold to accommodate the semiconductor components and the first metal structures. The fabrication method includes filling a packaging material between the lower mold and the upper mold. The fabrication method includes removing the upper mold, the lower mold and the first metal structures to form a plurality of through holes in the packaging material located on both sides of the semiconductor components.

Dependencies are inferred from the claim text.