Wafer edge tilt and etch rate uniformity
AssigneeLam Research Corporation
InventorsPratik Mankidy, Jaewon Kim
Life of this patent
Estimating the term…
Abstract
An edge ring for use in a plasma chamber includes a first pair of edge ring segments with each one of the first pair of edge ring segments having a first thickness and a second pair of edge ring segments with each one of the second pair of edge ring segments having a second thickness. Each of the first pair of edge ring segments is oriented adjacent to each of the second pair of edge ring segments and each of the second pair of edge ring segments is oriented adjacent to each of the first pair of edge ring segments.
Claims20
An edge ring surrounding a wafer in a plasma chamber, the edge ring comprising:
- a first pair of edge ring segments, wherein each one of the first pair of edge ring segments has a first thickness;
- and
- a second pair of edge ring segments, wherein each one of the second pair of edge ring segments has a second thickness, the first pair of edge ring segments oriented opposite to each other and the second pair of edge ring segments oriented opposite to each other,
- wherein each one of the first pair of edge ring segments is oriented adjacent to each one of said second pair of edge ring segments, and each one of the second pair of edge ring segments is oriented adjacent to each one of said first pair of edge ring segments.
A plasma chamber for processing a wafer, comprising:
- an upper electrode defined in a top portion for providing process gases into the plasma chamber;
- a pedestal defined in a bottom portion and oriented opposite to said upper electrode, the pedestal defining a wafer receiving region thereon;
- an edge ring received adjacent to and surround said wafer receiving region, said edge ring includes,
- a first pair of edge ring segments, wherein each one of said first pair of edge ring segments has a first thickness;
- and
- a second pair of edge ring segments, wherein each one of said second pair of edge ring segments has a second thickness, the first pair of edge ring segments oriented opposite to each other and the second pair of edge ring segments oriented opposite to each other,
- wherein each one of the first pair of edge ring segments is oriented adjacent to each one of said second pair of edge ring segments, and each one of the second pair of edge ring segments is oriented adjacent to each one of said first pair of edge ring segments.
An edge ring for surrounding a wafer in a plasma chamber, the edge ring comprising:
- a first zone having a first thickness;
- a second zone having a second thickness;
- a third zone defined opposite to the first zone and having the first thickness;
- a fourth zone defined opposite to said second zone and having the second thickness, each of said second and said fourth zones defined adjacent to and between said first and said third zones;
- and
- a transition region defined between each consecutive pair of the first, the second, the third and the fourth zones.
Dependencies are inferred from the claim text.