Plasma generation circuit and substrate processing device including the same

A plasma generation circuit comprising:

• a high frequency power source configured to generate a first high frequency current;
• a current divider comprising a first capacitor and a variable capacitor and configured to divide the first high frequency current into a second high frequency current and a third high frequency current;
• an antenna assembly comprising a center antenna connected to the current divider and through which the second high frequency current is configured to flow, and an edge antenna connected to the current divider and through which the third high frequency current is configured to flow, the antenna assembly being configured to induce generation of an inductively coupled plasma;
• a first busbar coupled inductor configured to allow the second high frequency current to flow therethrough;
• a second busbar coupled inductor configured to allow the third high frequency current to flow therethrough, and disposed to be apart from the first busbar coupled inductor in a horizontal direction;
• a first busbar connection portion connected in series with the first busbar coupled inductor;
• and
• a second busbar connection portion connected in series with the second busbar coupled inductor.

A plasma generation circuit comprising:

• a gas supply portion configured to supply plasma gas to a chamber configured to define a space for plasma-processing a substrate;
• a high frequency power source configured to generate a first high frequency current;
• a current divider comprising a first capacitor and a variable capacitor and configured to divide the first high frequency current into a second high frequency current and a third high frequency current;
• an antenna assembly comprising a center antenna connected to the current divider and through which the second high frequency current is configured to flow, and an edge antenna connected to the current divider and through which the third high frequency current is configured to flow, the antenna assembly being configured to induce generation of an inductively coupled plasma;
• and
• a coupled inductor disposed between the current divider and the antenna assembly,
• wherein:
• the center antenna and the edge antenna are provided to generate a first electromagnetic inductive coupling by mutual induction,
• the coupled inductor is provided to generate a second electromagnetic inductive coupling in a direction opposite to a direction of the first electromagnetic inductive coupling, and
• the first electromagnetic inductive coupling is canceled by the second electromagnetic inductive coupling,
• wherein the chamber comprises:
• an upper housing;
• a lower housing disposed below the upper housing;
• a window disposed between the upper housing and the lower housing;
• and
• a chuck configured to support the substrate.