Wiring structure and amplifier

Abstract

A wiring structure includes a MIM capacitor and a helical wiring. The wiring structure includes a substrate having a main surface and a back surface, a plurality of wiring layers sequentially stacked on or above the main surface. The plurality of wiring layers include a first wiring layer being a wiring layer closest to the substrate, a second wiring layer provided on or above the first wiring layer, and a third wiring layer provided on or above the second wiring layer. The MIM capacitor includes a first electrode included in the second wiring layer, a second electrode included in the third wiring layer, and a first electrically insulating layer provided between the first electrode and the second electrode. The helical wiring includes a first wiring included in the first wiring layer, a second wiring included in the second wiring layer, and a third wiring included in the third wiring layer.

Dependencies are inferred from the claim text.