US 2025/0149211 A1Published application

Chip resistor

AssigneeYageo Corporation

InventorsShen-Li HSIAO, Po-Hsun SHIH, Kuang-Cheng LIN

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Abstract

A chip resistor includes a substrate, first to fourth electrodes, a resistance layer, a resin electrode layer, first and second insulating protective layers, and first and second external electrode layers. The first and second electrodes are respectively disposed on two opposite edge areas of a front surface of the substrate. The resistance layer extends from the first electrode to the second electrode. The first insulating protective layer completely covers the resistance layer. The resin electrode layer includes first to third portions respectively covering the first and second electrodes, and a portion of the first insulating protective layer. The second insulating protective layer completely covers the third portion and partially covers the first and second portions. The third and fourth electrodes are disposed on a back surface of the substrate. The first and second external electrode layers respectively connect the first and third electrodes, and the second and fourth electrodes.

Claims15

Dependent claims

A chip resistor, comprising:

a substrate comprising a front surface and a back surface, wherein the front surface comprises a first edge area and a second edge area opposite to each other;
a first electrode and a second electrode respectively disposed on a portion of the first edge area and a portion of the second edge area;
a resistance layer disposed on the front surface and extending from the first electrode to the second electrode;
a first insulating protective layer completely covering the resistance layer;
a resin electrode layer, wherein the resin electrode layer comprises:
a first portion covering the first electrode and a portion of the first insulating protective layer adjacent to the first electrode;
a second portion covering the second electrode and a portion of the first insulating protective layer adjacent to the second electrode;
and
a third portion covering a portion of the first insulating protective layer which is on the resistance layer, wherein the first portion, the second portion, and the third portion are separated from each other;
a second insulating protective layer completely covering the third portion and partially covering the first portion and the second portion;
a third electrode and a fourth electrode disposed on the back surface and opposite to the first electrode and the second electrode respectively;
a first external electrode layer from the first electrode through a first side surface of the substrate to the third electrode;
and
a second external electrode layer from the second electrode through a second side surface of the substrate to the fourth electrode.

11 more elements

A chip resistor, comprising:

a substrate comprising a front surface and a back surface, wherein the front surface comprises a first edge area and a second edge area opposite to each other;
a first electrode and a second electrode respectively disposed on a portion of the first edge area and a portion of the second edge area;
a resistance layer disposed on the front surface and extending from the first electrode to the second electrode;
a first insulating protective layer completely covering the resistance layer;
a resin electrode layer, wherein the resin electrode layer comprises:
a first portion covering the first electrode and a portion of the first insulating protective layer adjacent to the first electrode;
and
a second portion covering the second electrode and a portion of the first insulating protective layer adjacent to the second electrode, wherein the second portion and the first portion are separated from each other;
a second insulating protective layer covering the first insulating protective layer between the first portion and the second portion and partially covering the first portion and the second portion;
a third electrode and a fourth electrode disposed on the back surface and opposite to the first electrode and the second electrode respectively;
a first external electrode layer from the first electrode through a first side surface of the substrate to the third electrode;
and
a second external electrode layer from the second electrode through a second side surface of the substrate to the fourth electrode.

10 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/543,875Filed 18 Dec 2023
Priority: TW 1121424433 Nov 2023
Published: 8 May 2025
Term ends: Not estimatedThe source records don’t support an estimate.

Classification7 codes

H01C 17/006
Apparatus or processes specially adapted for manufacturing resistors: adapted for manufacturing resistor chips
H01C 1/028
Housing; Enclosing; Embedding; Filling the housing or enclosure: the resistive element being embedded in insulation with outer enclosing sheath
H01C 1/142
Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors: the terminals or tapping…
H01C 1/148
Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors: the terminals embracing or…

Family

No related US applications are recorded in the indexed filing history.

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