Metal-Containing Structures, and Methods of Treating Metal-Containing Material to Increase Grain Size and/or Reduce Contaminant Concentration

A method of forming a conductive structure, comprising:

• forming a metal-containing conductive material over a supporting substrate, the metal-containing conductive structure comprising at least one metal selected from the group consisting of Co, Mo, Nb, and Al;
• and
• exposing a surface of the metal-containing conductive material to at least one radical form of hydrogen and to at least one oxidant;
• the exposing altering at least a portion of the metal-containing conductive material to thereby form at least a portion of the conductive structure, the altering comprising one or more of a change in crystallinity of the metal-containing conductive material, an increase in a grain size of the metal-containing conductive material, and a reduction of a concentration of at least one contaminant within the metal-containing conductive material.