Resist pattern inspection method, resist pattern manufacturing method, substrate selection method, and manufacturing method for semiconductor package substrate or printed circuit board

Abstract

A resist pattern inspection method includes performing an outer appearance inspection on a resist pattern based on light emission from a substrate on which the resist pattern is formed. A resist pattern manufacturing method includes forming a resist pattern on a substrate; and impregnating the resist pattern with a light-emitting material after the forming of the resist pattern. A substrate selection method includes performing an outer appearance inspection on a resist pattern based on light emission from a substrate on which the resist pattern is formed; and evaluating the resist pattern based on the outer appearance inspection in performing the outer appearance inspection. A manufacturing method for a semiconductor package substrate or a printed circuit board includes forming a conductor pattern by performing etching process or plating process on the substrate in which evaluation of the resist pattern in the substrate selection method satisfies a reference.

Dependencies are inferred from the claim text.