Cross-linkers for metallic photoresist

A photoresist solution, comprising:

• a metallic photoresist and a metallic cross-linker;
• wherein the metallic cross-linker comprises a metal core and a plurality of ligands, wherein the metal core has 1 to 12 metal atoms, and the plurality of ligands comprises:
• at least one ligand that comprises at least one vinyl group or at least one acetylene group;
• or
• at least one ligand that comprises an acrylate;
• or
• at least one ligand that comprises a cinnamate;
• or
• at least one ligand that cannot participate in a crosslinking reaction.

A method, comprising:

• coating a substrate with a photoresist solution;
• pre-baking the coated substrate to cure the photoresist solution and form a photoresist layer;
• exposing the photoresist layer to radiation to pattern the photoresist layer;
• optionally performing a post-exposure bake of the coated substrate;
• and
• developing the patterned photoresist layer using a developer;
• wherein the photoresist solution includes a metallic cross-linker;
• or
• wherein the coated substrate is treated with a treatment solution that contains a metallic cross-linker during or after the coating step or the pre-baking step;
• and
• wherein the metallic cross-linker comprises a metal core and a plurality of ligands, wherein the metal core has 1 to 12 metal atoms, and the plurality of ligands comprises:
• at least one ligand that comprises at least one vinyl group or at least one acetylene group;
• or
• at least one ligand that comprises an acrylate;
• or
• at least one ligand that comprises a cinnamate;
• or
• at least one ligand that cannot participate in a crosslinking reaction.