Package structure and manufacturing method thereof

A manufacturing method of a package structure, comprising:

• providing a plurality of optoelectronic assemblies, each having an electronic integrated circuit, a photonic integrated circuit, and a plurality of hybrid bonding pads, wherein the electronic integrated circuit is bonded on the photonic integrated circuit through the plurality of hybrid bonding pads;
• providing a plurality of organic interposers;
• assembling the plurality of optoelectronic assemblies on the plurality of organic interposers;
• assembling an application specific integrated circuit on a package substrate, wherein the application specific integrated circuit is electrically connected to the package substrate;
• and
• assembling the plurality of organic interposers and the plurality of optoelectronic assemblies assembled thereon onto the package substrate, wherein the plurality of organic interposers and the plurality of optoelectronic assemblies assembled thereon surround the application specific integrated circuit and are electrically connected to the package substrate.