Package assembly and manufacturing method thereof

A package assembly, comprising:

• an optical engine comprising:
• a photonic integrated circuit component comprising an optical input/output portion configured to transmit and receive optical signal;
• an electric integrated circuit component, electrically connected to the photonic integrated circuit component;
• an insulating encapsulant encapsulating the electric integrated circuit component;
• and
• a support layer disposed on the electric integrated circuit component and the insulating encapsulant;
• a lens secured on a sidewall of the photonic integrated circuit component;
• and
• an optical signal port connected with the optical engine and optically coupled to the optical input/output portion through the lens.

A manufacturing method of a package assembly, comprising:

• providing an optical engine comprising:
• a photonic integrated circuit component comprising an optical input/output portion configured to transmit and receive optical signal;
• an electric integrated circuit component, electrically connected to the photonic integrated circuit component;
• an insulating encapsulant laterally surrounded the electric integrated circuit component;
• and
• a support layer disposed on the electric integrated circuit component and the insulating encapsulant;
• securing a lens on a sidewall of the photonic integrated circuit component;
• and
• attaching an optical signal port onto the optical engine.