Probe card, probe head, method for manufacturing the probe head, and electronic device under test tested by the probe card

A method for manufacturing a probe head, comprising the following steps:

• placing, among a plurality of probes, the probes in pairs such that each pair is placed parallel to each other, thereby forming a plurality of probe pairs;
• aligning, for each probe pair, two head portions and two tail portions of the two probes contained within the probe pair;
• forming, for each probe pair, an insulating spacer between the two probes in the same probe pair, such that the insulating spacer is coupled with the two probes;
• and
• passing the plurality of tail portions and a plurality of head portions of the plurality of probe pairs through an upper guide plate and a lower guide plate, thereby positioning the plurality of probe pairs between the upper guide plate and the lower guide plate, wherein:
• at least one of the upper guide plate or the lower guide plate contains a plurality of enlarged guide holes, each enlarged guide hole accommodating a part of the two probes contained in one of the probe pairs and at least a part of the insulating spacer between the two probes, and an aperture of each enlarged guide hole is larger than an aperture of a grounding guide hole adjacent to the same enlarged guide hole;
• and
• at least one of the upper guide plate and the lower guide plate also contains a plurality of non-enlarged guide holes, each non-enlarged guide hole accommodating a part of one of the probes, so that the head portion or tail portion of each probe pair that is not coupled by the insulating spacer therebetween passes through individually.