Sensor module and manufacturing method of the same

A sensor module comprising:

• a substrate having a first region, a second region, and a third region in one direction, and having a first recess in the second region;
• a lower insulation layer provided on the substrate;
• a supporting layer provided on the lower insulation layer;
• a first upper insulation layer provided on the supporting layer;
• heater electrodes provided on the first upper insulation layer of the second region;
• a second upper insulation layer provided on the heater electrodes and the first upper insulation layer;
• lower electrodes provided on the second upper insulation layer;
• a third upper insulation layer on the lower electrodes and the second upper insulation layer;
• upper electrodes provided on the third upper insulation layer;
• a fourth upper insulation layer provided on the upper electrodes of the first region;
• a gas sensor layer provided on the upper electrodes of the second region;
• and
• a humidity sensor layer provided on the upper electrodes of the third region, and being thinner than the gas sensor layer.

A method for manufacturing a sensor module, the method comprising:

• forming a lower insulation layer, a supporting layer, and a first upper insulation layer on a substrate having a first region, a second region, and a third region;
• forming heater electrodes on the first upper insulation layer of the second region;
• forming a second upper insulation layer on the heater electrodes and the first upper insulation layer;
• forming lower electrodes on the second upper insulation layer of the first to third regions;
• forming a third upper insulation layer on the lower electrodes and the second upper insulation layer;
• forming upper electrodes on the third upper insulation layer of the first to third regions;
• forming a fourth upper insulation layer on the upper electrodes and the third upper insulation layer of the first region;
• removing portions of the substrate, the lower insulation layer, the supporting layer, and the first to third upper insulation layers of the second region to form a first MEMS hole, a first via hole, and a first preliminary recess;
• forming a gas sensor layer in an upper portion of the upper electrodes of the second region, and in the first preliminary recess and the first via hole;
• further removing a portion of the substrate below the gas sensor layer to form a first recess;
• and
• forming a humidity sensor layer on the upper electrodes of the third region.