Thermal imaging method for crack and hole detection in semiconductor devices

Abstract

The system includes a first laser light source configured to emit laser light, a first focusing lens configured to direct the laser light from the first laser light onto a first face of a workpiece, a thermal camera configured to capture a thermal image of a second face of the workpiece that is orthogonal to the first face, and a processor configured to identify a crack in the workpiece based on the thermal image.

Dependencies are inferred from the claim text.